Packaging method and package for edge-coupled optoelectronic...

Details Packaging method and package for edge-coupled optoelectronic... Packaging method and package for edge-coupled optoelectronic...

H - Electricity

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H01L 31/02 (2006.01) G02B 6/42 (2006.01) H01L 31/0203 (2006.01) H01S 5/022 (2006.01) H01L 33/00 (2006.01)

Patent

CA 2018900

PACKAGING METHOD AND PACKAGE FOR EDGE-COUPLED OPTOELECTRONIC DEVICE Abstract of the Disclosure An edge-coupled optoelectronic device is mounted in a TO-style package which comprises a substrate assembly, a circular header and a cylindrical cap. A substrate and an insulating cover of the substrate assembly extend through an opening of the circular header and are secured in that opening. The optoelectronic device is secured to the substrate at a device support location. Electrical conductors are wire-bonded at contacts of the optoelectronic device and at corresponding device contacts of the substrate assembly to electrically connect the contacts of the optoelectronic device to respective conductors of the substrate assembly. The cylindrical cap is secured onto the header over the optoelectronic device. -i-

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