Packaging microminiature devices

Details Packaging microminiature devices Packaging microminiature devices

H - Electricity

01

L

356/134

H01L 27/04 (2006.01) H01L 21/72 (1985.01)

Patent

CA 1228179

- 10 - INTEGRATED CIRCUIT CHIP ASSEMBLY Abstract A compact assembly of integrated circuit chips is produced by inserting chips into wells, grooves, or openings in a carrier substrate. Chips have beveled edges as produced by anisotropic chemical etching, and the substrate has sloping walls so as to allow positioning by match-up with beveled edges of chips. Electrical interconnection of circuits is by patterned metallization overlying chips and substrate.

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