Packaging of high power semiconductor lasers

Details Packaging of high power semiconductor lasers Packaging of high power semiconductor lasers

H - Electricity

01

S

H01S 5/022 (2006.01) H01L 33/00 (2006.01) H01S 5/00 (2006.01) H01S 3/18 (1995.01) H01S 3/025 (1995.01)

Patent

CA 2128068

Abstract of the Disclosure A package for a high power semiconductor laser comprising a hermetically sealed container filled with a dry gaseous medium containing oxygen. The package also may include a getter for organic impurities, e.g., a getter composed of a porous silica or a zeolite. The hydrogen content of the materials used to form the package can be reduced by baking at an elevated temperature for an extended period of time, e.g., at 150°C for 200 hours.

Emballage pour laser à semi-conducteur de forte puissance comprenant un contenant scellé hermétiquement et rempli d'un milieux gazeux sec contenant de l'oxygène. L'emballage peut également comprendre un dégazeur chargé de traiter les impuretés organiques, le dégazeur étant composé de silice poreux ou de zéolite. La teneur en hydrogène des matériaux utilisés pour former l'emballage peut être réduite par cuisson des matériaux à température élevée, pendant une période prolongée, p. ex. à 150 degrés Celsius pendant 200 heures.

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