Packaging of low application hot melt adhesive formulations

Details Packaging of low application hot melt adhesive formulations Packaging of low application hot melt adhesive formulations

B - Operations, Transporting

65

B

B65B 63/08 (2006.01) B29B 13/02 (2006.01) C09J 11/00 (2006.01)

Patent

CA 2448664

Films having a melting point below about 100~C are used to package low temperature hot melt adhesives. The packaging film does not require removal prior to use of the adhesive. The packaged adhesive is easy to handle and units are non-blocking.

La présente invention concerne des films possédant un point de fusion situé en dessous d'environ 100 ·C, utilisés pour emballer des adhésifs thermofusibles à faible température d'application. Il n'est pas nécessaire d'enlever le film d'emballage préalablement à l'utilisation. L'adhésif emballé est facile à manipuler et les unités sont non bloquantes.

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