Packaging structure for one or more ic chips

Details Packaging structure for one or more ic chips Packaging structure for one or more ic chips

H - Electricity

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H01L 23/32 (2006.01) H01L 21/60 (2006.01) H01L 23/10 (2006.01) H01L 23/40 (2006.01) H01L 23/498 (2006.01) H01L 23/538 (2006.01)

Patent

CA 2074575

ABSTRACT OF THE DISCLOSURE A packaging structure is disclosed for one or more integrated circuit (IC) chips for use in a data processing device. The structure comprises at least one IC chip having a plurality of pads and a frame associated with the or each IC chip and connected at one end to the periphery of the top of the IC chip. The structure further includes a wiring substrate having on one of the opposite major surfaces thereof a plurality of bumps to be connected to the pads, and a pad to be connected to the other end of the frame.

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