Packaging system for cooling electronic equipment

Details Packaging system for cooling electronic equipment Packaging system for cooling electronic equipment

H - Electricity

05

K

347/36

H05K 7/20 (2006.01)

Patent

CA 1072669

PACKAGING SYSTEM FOR COOLING ELECTRONIC EQUIPMENT Abstract of the Disclosure Electrical circuit boards are aligned with corresponding slots in a plenum chamber. Each slot has an outwardly turned lip. The chamber has a cross section which decreases uniformly from a blower. Further electrical components are placed in the path of inlet air to the blower. All of these units are rigidly mounted on a swing-out gate.

269861

Affiliated with

Also associated with

Rating

Packaging system for cooling electronic equipment does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaging system for cooling electronic equipment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging system for cooling electronic equipment will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1152041