C - Chemistry – Metallurgy – 22 – C
Patent
C - Chemistry, Metallurgy
22
C
6/4, 117/77, 75/
C22C 5/00 (2006.01) C23C 18/44 (2006.01)
Patent
CA 1122753
ABSTRACT OF THE DISCLOSURE A bath for the electroless deposition of palladium comprises an aqueous solution of divalent palladium, ammonia or amine, and a tertiary amine borane. The bath may contain thio-organic, iminonitrile or other stabilizers. A hard palladium alloy is plated, having the composition of 1-3% amorphous borone, 1-3% crystalline PdH0.706, the remainder amorphous palladlus. A strong laminate is formed when the alloy is plated on electroless nickel.
341302
Hough William V.
Little John L.
Warheit Kevin E.
Mine Safety Appliances Company
Sim & Mcburney
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