Palladium and palladium alloy plating

Details Palladium and palladium alloy plating Palladium and palladium alloy plating

C - Chemistry, Metallurgy

25

D

204/26, 204/29.5

C25D 3/50 (2006.01) C25D 3/52 (2006.01) C25D 3/56 (2006.01)

Patent

CA 1291440

ABSTRACT PALLADIUM AND PALLADIUM ALLOY PLATING The difficulties associated with electroplating palladium metal or alloy deposits from palladium diammino dichloride, palladium diammino dinitrite and palladium triammino sulphite baths can be avoided by plating from palladium baths containing oxalate. The palladium and oxalate may be in a single complex, such as palladium diammino oxalate, (Pd(NH3)2C2O4), palladium tetrammino oxalate (Pd(NH3)4C2O4) or an ammonium or alkali metal salt of palladium dioxalate (M2Pd(C2O4))2), where M represents an ammonium or alkali metal cation. Alloying metal ions may also be present, as may an electrolyte, a brightener and/or a stress reducer.

500357

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