Palladium and palladium alloys electroplating procedure

Details Palladium and palladium alloys electroplating procedure Palladium and palladium alloys electroplating procedure

C - Chemistry, Metallurgy

25

D

204/26, 204/29.5

C25D 3/52 (2006.01) C25D 3/56 (2006.01)

Patent

CA 1189016

- 1 - Abstract: A procedure for electroplating palladium and palladium alloys is disclosed which permits rapid and efficient plating and yields ductile, adherent palladium films. The electroplating bath comprises a unique complex of palladium and aliphatic polyamine is selected from the group consisting of diaminopropane (including 1,1-di- aminopropane), diethylenetriamine, 1,4-diaminobutane, 1,6-diaminohexane, N,N,N',N'-tetramethyl-ethylenediamine and 2-hydroxy-1,3-diaminopropane.

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