Palladium colloid solution and its utilisation

Details Palladium colloid solution and its utilisation Palladium colloid solution and its utilisation

C - Chemistry, Metallurgy

25

D

C25D 3/52 (2006.01) C25D 5/02 (2006.01) C25D 5/54 (2006.01)

Patent

CA 2186482

The invention relates to a palladium colloid solution, which, in addition to a palladium compound, a protective colloid for stabilising the colloid and a reducing agent, additionally contains noble metals from the group rhodium, iridium and platinum. The solution can be used to treat electrically non-conductive substrate surfaces, particularly in order to metalise the substrate surfaces directly and electrolytically. By means of this method, the non-conductive areas of the holes in printed circuit boards can be directly electrolytically metallised.

L'invention concerne une solution colloïdale de palladium, qui outre un composé de palladium, un colloïde protecteur destiné à stabiliser le colloïde et un réducteur, contient des métaux précieux issus du groupe comprenant le rhodium, l'iridium et le platine. Cette solution peut être utilisée pour traiter des surfaces de substrats non conductrices électriquement, en particulier pour métalliser directement les surfaces de substrat par électrolyse. Ce procédé permet de métalliser directement les zones non conductrices des trous dans les circuits imprimés.

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