Palladium electroplating bath, process and preparation

Details Palladium electroplating bath, process and preparation Palladium electroplating bath, process and preparation

C - Chemistry, Metallurgy

25

D

204/26, 204/29.5

C25D 3/50 (2006.01) C25D 3/56 (2006.01)

Patent

CA 1044635

ABSTRACT OF THE DISCLOSURE Disclosed is an aqueous plating bath suitable for obtaining electrodeposita of palladium and its alloys. The bath is substantially free of cyanide, nitrate and nitrite, and comprises sulfite ion, palladium in the form of tetra- coordinated complex with palladium in the +2 oxidation state, an atomic ration of halide to palladium not in excess of 0.1, and exhibits a pH of 7 to 12.

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