Panel units having in situ formed moldings

B - Operations – Transporting – 29 – C

Patent

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Details

B29C 70/76 (2006.01) B29C 47/08 (2006.01) B29C 47/12 (2006.01) B32B 7/12 (2006.01) B60J 10/04 (2006.01) E06B 3/78 (2006.01) E06B 3/96 (2006.01) E06B 7/23 (2006.01)

Patent

CA 2365058

Methods for manufacturing panel units may include applying a cover tape to a surface of a panel in such a way as to substantially extend along a periphery of the panel. An extrusion molding die may be moved relative to the panel in such a way that the extrusion molding die moves along the periphery of the panel while at least partially contacting the cover tape applied to the panel. At the same time, a molten molding material may be extruded from the extrusion molding die, thereby integrally forming a molded article on the periphery of the panel. The cover tape may be then removed from the surface of the panel in order to produce a panel unit having the molded article disposed along the periphery of the panel.

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