Particle board manufacture using polyisocyanate binder with...

Details Particle board manufacture using polyisocyanate binder with... Particle board manufacture using polyisocyanate binder with...

C - Chemistry, Metallurgy

08

L

18/1009, 154/97

C08L 97/02 (2006.01) C08L 75/04 (2006.01)

Patent

CA 1161619

Abstract of the Disclosure The use of polyisocyanates as binders in the preparation of particle boards is subject to the drawback that the boards exhibit a tendency to adhere to the face of the platens used in their formation. This problem is minimized by incorporating minor amounts of certain phosphinic and or phosphonic acids or derivatives thereof or phosphites into the polyisocyanate to be used as binder. The polyisocyanates and the phosphorus compounds are applied to the particles separately, or after preblending one with the other. Whether the components are applied separately or in combination one with the other, they can each be applied either neat or in the form of an emulsion or emulsions.

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