H - Electricity – 05 – K
Patent
H - Electricity
05
K
H05K 1/03 (2006.01) B65D 85/90 (2006.01) H05K 1/09 (2006.01) H05K 3/00 (2006.01) H05K 3/20 (2006.01) H05K 3/28 (2006.01) H05K 1/00 (2006.01) H05K 3/34 (2006.01)
Patent
CA 2224188
A masking film (3) having desired apertures (2) is applied to a metal wiring board (1). With this construction, a conventional insulation substrate which is to be a thick base and a conventional resist layer can be eliminated. Further, when the terminal parts (T) of the metal wiring board (1) are bent, connection terminals which are substituted for connector terminals for the connection to another board are formed integrally to eliminate the connector terminals. Thus, a low cost component mounting board is provided.
On applique un film masque (3) ayant des ouvertures souhaitées (2) à un tableau de connexions métalliques (1). Grâce à cette construction, il est possible de supprimer le substrat isolant traditionnel qui doit être une base épaisse ainsi qu'une couche traditionnelle de résist. De plus, lorsque les parties terminales (T) du tableau de connexions métalliques (1) sont pliées, des bornes de connexion, qui sont substituées aux bornes connectrices assurant la connexion avec une autre carte, sont formées d'une pièce de façon à supprimer les bornes connectrices. De cette manière, on obtient une carte de montage de composants à faible coût.
Edahiro Teruki
Kumagai Koichi
Wada Yoshinori
Kirby Eades Gale Baker
Matsushita Electric Industrial Co. Ltd.
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