Passivated and encapsulated semiconductors and method of...

Details Passivated and encapsulated semiconductors and method of... Passivated and encapsulated semiconductors and method of...

H - Electricity

01

L

356/168

H01L 23/28 (2006.01) H01L 23/29 (2006.01) H01L 23/31 (2006.01) H01L 23/48 (2006.01) H01L 23/492 (2006.01)

Patent

CA 1057420

PASSIVATED AND ENCAPSULATED SEMICONDUCTORS AND METHOD OF MAKING SAME. MONROE B. GOLDBERG and WILLIAM B. VOORHIS ABSTRACT OF THE DISCLOSURE A semiconductor assembly having a semiconductor and conductive lead members secured thereto by conductive metal contact members is passivated by a layer of fused particles of non-conductive glass and encapsulated in a layer of non-conductive plastic. The product combines the best characteristics of a glass passivated semiconductor and a plastic encapsulated semiconductor while avoid- ing the disadvantages of both.

258818

Affiliated with

Also associated with

Rating

Passivated and encapsulated semiconductors and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Passivated and encapsulated semiconductors and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Passivated and encapsulated semiconductors and method of... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-879128