Passivation of metallic equipment surfaces in electroless...

Details Passivation of metallic equipment surfaces in electroless... Passivation of metallic equipment surfaces in electroless...

C - Chemistry, Metallurgy

23

C

117/80, 204/88

C23C 18/16 (2006.01) C23F 13/00 (2006.01) H05K 3/18 (2006.01)

Patent

CA 1183101

ABSTRACT OF THE DISCLOSURE The metallic surfaces of plating equipment in use during electroless copper deposition, such as vessels, racks supporting substrates being plated, plumbing, and the like are rendered substantially resistant to electroless copper deposition for extended periods by initially imposing on such equipment surfaces an electrical potential more positive than the mixed potential of the electroless copper solution and sufficiently positive to resist electroless deposition, electro- lessly depositing copper on the substrate being plated, and while depositing such copper maintaining on the equipment surface a potential sufficiently positive to resist the formation of adherent electroless copper deposits.

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