Passive electronic components prepared from suspensions of...

C - Chemistry – Metallurgy – 04 – B

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C04B 35/622 (2006.01) C04B 41/52 (2006.01) C04B 41/89 (2006.01) H01C 7/00 (2006.01) H01C 7/112 (2006.01) H01G 4/08 (2006.01) H01G 4/12 (2006.01) H01G 4/33 (2006.01)

Patent

CA 2268110

Nanosize powders with particle size smaller than the critical length for specific material properties are used to form the ceramic layers of passive electronic components. Ceramic substrates are coated with electrodes, which are then coated with a ceramic layer from a suspension, preferably a low viscosity suspension, of nanoscale powders. The ceramic layer is dried at low temperatures (preferably below 200 ~C) and it is sintered to high density (preferably above 90 %) at moderate temperatures (preferably low and less than 1,000 ~C). Once sintered, an electrode layer is coated on top of the ceramic layer to yield an electrode/ceramic/electrode structure.

La présente invention concerne la formation de couches céramiques de composants électroniques passifs en utilisant des poudres de calibre nanométrique dont les dimensions de particules sont inférieures à la longueur critique pour certaines propriétés du matériau. Le procédé consiste à appliquer sur des substrats céramiques des électrodes qui sont ensuite recouvertes d'une couche céramique à partir d'une suspension, de préférence de faible viscosité, de poudres de calibre nanométrique. Plus particulièrement, le procédé consiste à faire sécher la couche céramique à faibles températures (de préférence en dessous de 200 ·C) et à la fritter à haute densité (de préférence au-dessus de 90%) à températures modérées (de préférence basses et inférieures à 1.000 ·C). Après le frittage, on applique une couche électrode au-dessus de la couche céramique pour obtenir la structure électrode/céramique/électrode.

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