Passive microwave structures and methods having reduced...

H - Electricity – 05 – K

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

H05K 9/00 (2006.01) B23P 11/00 (2006.01) H01P 7/04 (2006.01) H01P 11/00 (2006.01) H01Q 15/00 (2006.01) H01Q 17/00 (2006.01)

Patent

CA 2210113

A simple joining process for members of passive microwave structures is described which reduces passive intermodulation. The process forms an aperture (28) in a first member (22) and forms a second member (24) to have dimension which exceeds the aperture dimension by a dimension differential. The members are joined by initially causing them to have a temperature differential that is sufficient to permit the second member to be positioned across the aperture. The dimension differential is selected to generate mutually-induced radial stresses in the members, after the temperature differential is removed, which enhance the metal-to-metal contact between the members and, thereby, improve passive intermodulation (PIM) performance. Preferably, the dimension differential is selected to cause the second member to elastically buckle and exert a buckling stress against the first member. Additional interface structures are provided to resist operational axial forces, e.g., vibration, that tend to dislodge the members.

Procédé simple de jonction d'éléments de structures à micro-ondes passives, permettant de réduire l'intermodulation à l'état passif (PIM). Consiste à former une ouverture (28) dans un premier élément (22) puis à former un deuxième élément (24) plus grand que l'ouverture. Pour joindre les éléments, on produit d'abord entre eux une différence de température suffisante pour que le deuxième élément puisse être placé dans l'ouverture. La différence de grandeur entre lesdits éléments est déterminée de façon à provoquer dans ceux-ci des contraintes radiales réciproques après suppression de la différence de température, ce qui améliore le contact de métal à métal entre les éléments et améliore ainsi la performance au niveau de la PIM. De préférence, la différence de grandeur est déterminée de façon que le deuxième élément subisse un flambement élastique et exerce une contrainte de flambement sur le premier élément. Des structures d'interface supplémentaires offrent une résistance aux forces axiales opérationnelles, p. ex. vibration, qui tendent à détacher les éléments.

LandOfFree

Say what you really think

Search LandOfFree.com for Canadian inventors and patents. Rate them and share your experience with other people.

Rating

Passive microwave structures and methods having reduced... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Passive microwave structures and methods having reduced..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Passive microwave structures and methods having reduced... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFCA-PAI-O-1357976

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.