G - Physics – 03 – F
Patent
G - Physics
03
F
96/150
G03F 7/075 (2006.01)
Patent
CA 1335542
Pattern-forming material useful in producing highly accurate submicron patterns having unusually high aspect ratios at superior resolutions are obtained by using a solvent-soluble polyorganosiloxane having SiO4/2 units and at least one other organosiloxane unit which contains a high energy radiation sensitive group. The polyorganosiloxane has a softening temperature greater than room temperature.
582506
Mine Katsutoshi
Muramoto Naohiro
Dow Corning Toray Silicone Company Limited
Gowling Lafleur Henderson Llp
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