Patterned release film between two laminated surfaces

B - Operations – Transporting – 32 – B

Patent

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Details

B32B 7/04 (2006.01) B32B 7/06 (2006.01) B32B 37/30 (2006.01)

Patent

CA 2380093

A method of forming a laminate structure comprises providing a first substrate and a second substrate each having first and second substrate surfaces respectively, and wherein the surfaces are present in an opposed spaced apart relationship; contacting at least one of the first or second substrate surfaces with a release material such that a portion of the first or second substrate surface is covered with the release material while the remainder of the first or second substrate surface is not covered with the release material; bringing the first and second substrate surfaces of the first and second substrates into contact with each other; and subjecting the substrates to conditions such that the portions of the first and second substrate surfaces not covered with release material become bonded to one another and a laminate structure is formed. The portion of the first or second substrate surface covered with the release material allows the first and second substrates to separate from each other such that an opening is formed therebetween that is substantially coincident with the portion covered with the release material.

Cette invention concerne un procédé de fabrication d'une structure laminée qui consiste à : prendre un premier et d'un second substrat présentant chacun une première et une seconde surfaces séparées l'une de l'autre et opposées; mettre en contact au moins l'une des surfaces des substrats avec un matériau détachable de sorte qu'une partie de la première ou de la seconde surface des substrats soit recouverte par ledit matériau, alors que le reste de ladite première ou seconde surface n'en est pas recouverte; mettre en contact réciproque la première et la seconde surfaces du premier et du second substrat; et soumettre les substrats à des conditions telles que les parties des première et seconde surfaces des substrats recouvertes par le matériau détachable se collent l'une à l'autre pour former une structure laminée. La partie de la première ou de la seconde surface des substrats qui est recouverte par le matériau détachable permet aux premier et second substrats de se séparer l'un de l'autre, ce qui matérialise entre eux une ouverture coïncidant pour l'essentiel avec la partie recouverte du matériau détachable.

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