Patterned structure reproduction using nonsticking mold

Details Patterned structure reproduction using nonsticking mold Patterned structure reproduction using nonsticking mold

B - Operations, Transporting

44

B

B44B 5/00 (2006.01) B29C 33/62 (2006.01) B81C 1/00 (2006.01) G03F 7/00 (2006.01) B29C 33/38 (2006.01)

Patent

CA 2462347

Nonstick molds (16) and method of forming and using such molds are provided. The molds are formed of a nonstick material such as those selected from the group consisting of fluoropolymers, fluorinated siloxane polymers, silicones, and mixtures thereof. The nonstick mold is imprinted with a negative image of a master mold, where the master mold is designed to have a topography pattern corresponding to that desired surface on the surface of a microelectronic substrate. The nonstick mold (16) is then used to transfer the pattern or image (18) to a flowable film (20) on the substrate (22) surface. This film is subsequently cured or hardened, resulting in the desired pattern (26) ready for further processing.

L'invention concerne des moules antiadhésifs et des procédés de fabrication et d'utilisation de ces moules. Ces moules sont constitués d'un matériau antiadhésif choisi dans le groupe constitué des éléments suivants : fluoropolymères, polymères siloxane fluorés, silicones et leurs mélanges. Ces moules antiadhésifs comportent une image négative d'un moule maître, lequel est conçu de façon qu'il comporte un motif topographique correspondant au motif souhaité sur la surface d'un substrat micro-électronique. Ces moules antiadhésifs sont ensuite utilisés pour transférer le motif ou l'image sur un film fluide recouvrant la surface du substrat. Ce film est ultérieurement cuit ou durci, afin de créer un motif souhaité prêt pour un traitement ultérieur.

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