C - Chemistry – Metallurgy – 22 – C
Patent
C - Chemistry, Metallurgy
22
C
C22C 13/00 (2006.01) B23K 35/26 (2006.01)
Patent
CA 2529350
A Pb-free solder alloy is designed from the Sn based substrate, which is a non- toxic and environmental friendly metal. The Pb-free solder includes a ternary composition consisting essentially of 4.0 weight % Cu, 0 to 0.1 weight % P, and 95.9 to 96.0 weight % Sn, having off-eutectic melting temperatures of 230 to 250°C. The addition of P in one of the inventions is to enhance high temperature micro-structural stability, thermal--mechanical strength, and to reduce dross formation, during Reflow Soldering, Hand Soldering, and Wave Soldering, that require high temperature soldering application in the Electronics Assembly Processes.
Leung David D. L.
Na
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