Pb-free sn-based solder alloys for high temperature...

C - Chemistry – Metallurgy – 22 – C

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C22C 13/00 (2006.01) B23K 35/26 (2006.01)

Patent

CA 2529350

A Pb-free solder alloy is designed from the Sn based substrate, which is a non- toxic and environmental friendly metal. The Pb-free solder includes a ternary composition consisting essentially of 4.0 weight % Cu, 0 to 0.1 weight % P, and 95.9 to 96.0 weight % Sn, having off-eutectic melting temperatures of 230 to 250°C. The addition of P in one of the inventions is to enhance high temperature micro-structural stability, thermal--mechanical strength, and to reduce dross formation, during Reflow Soldering, Hand Soldering, and Wave Soldering, that require high temperature soldering application in the Electronics Assembly Processes.

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