Pb-free solder alloy compositions comprising essentially...

Details Pb-free solder alloy compositions comprising essentially... Pb-free solder alloy compositions comprising essentially...

B - Operations, Transporting

23

K

B23K 35/24 (2006.01)

Patent

CA 2502747

A Pb-free solder alloy is designed from the Sn based substrate, which is a non- toxic and environmental friendly metal. The Pb-free solder includes a tetra-nary composition consisting essentially of about 99.0 weight % Sn, 0.3 to 0.5 weight % Ag, and 0.5 to 0.7 weight % Cu, having off-eutectic melting temperatures of about 217-227 degree Celsius. The fourth ingredient is a non-metal, Phosphorus (P). 0.1 To 1.0 weight % P is added to the said composition, to enhance better micro-structural stability and to reduce dross formation, during Hand Soldering, and Wave Soldering in Electronics Assembly Processes.

Affiliated with

Also associated with

Rating

Pb-free solder alloy compositions comprising essentially... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Pb-free solder alloy compositions comprising essentially..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Pb-free solder alloy compositions comprising essentially... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1660520