Pb-free solder alloy compositions comprising essentially sn,...

Details Pb-free solder alloy compositions comprising essentially sn,... Pb-free solder alloy compositions comprising essentially sn,...

C - Chemistry, Metallurgy

22

C

C22C 13/00 (2006.01) B23K 35/22 (2006.01) B23K 35/26 (2006.01)

Patent

CA 2389446

A Pb-free solder alloy is designed from the Sn based substrate, which is a non- toxic and environmental friendly metal. The Pb-free solder includes a binary composition consisting essentially of about 96.5 weight % Sn and 3.5 weight % Ag, having an eutectic temperature of 221 degree Celsius. In addition, a Pb-free solder includes a ternary composition consisting essentially of about 95.5 to 96.5 weight % Sn, 3.0 to 3.5 weight % Ag, and 0.5 to 0.7 weight % Cu, having off eutectic melting temperatures of about 215-220 degree Celsius. The said solder compositions can be modified with addition of 0.1 to 1.0 weight % P, to enhance better micro-structural stability and to reduce dross formation, during Hand Soldering, Wave Soldering, and Reflow Soldering in Electronics Assembly Processes.

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