Pb-free solder alloy compositions comprising essentially tin...

Details Pb-free solder alloy compositions comprising essentially tin... Pb-free solder alloy compositions comprising essentially tin...

B - Operations, Transporting

23

K

B23K 35/26 (2006.01)

Patent

CA 2540486

A Pb-free solder alloy is designed from the Sn based substrate, which is a non- toxic and environmental friendly metal. The Pb-free solder includes a composition consisting essentially of 0.3 - 0.4 weight % Ag, 0.6 - 0.7 weight % Cu, 0.01 - 1.0 weight % Ni, 0.01 - 0.3 weight % P, optionally 0.001 - 0.3 weight % Ce, or 0.001 - 0.3 weight % La, and a balance of Sn, having off-eutectic melting temperatures of about 221-233 degree Celsius. Addition of Ni forms fine crystal texture, or forms Ni-Sn compounds, thereby improving strength and thermal fatigue characteristic. Furthermore, 0.001 - 0.3 weight % Trace amount of Ce and / or La rare earth added to the said composition, to enhance better micro-structural stability and to reduce the coarse Sn grains in the microstructure of the solder joint formed, during Hand Soldering, Wave Soldering and Reflow Soldering in Electronics Assembly Processes.

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