Pb-free solder-connected structure and electronic device

Details Pb-free solder-connected structure and electronic device Pb-free solder-connected structure and electronic device

H - Electricity

01

L

H01L 23/488 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2493351

An electronic device comprising a substrate and a semiconductor device both of which are connected with each other by means of a Pb-free solder. The Pb-free solder comprises Bi. The semiconductor device has a lead thereon. The lead has an Sn-Bi alloy layer comprising 1 to 20 wt%. The lead may be composed of Cu or a Cu alloy, or an Fe-Ni alloy.

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