Peelable bonded structures and process for preparing same

Details Peelable bonded structures and process for preparing same Peelable bonded structures and process for preparing same

B - Operations, Transporting

32

B

18/52, 154/92.2

B32B 7/06 (2006.01) B05D 1/32 (2006.01) B05D 7/00 (2006.01) B05D 7/14 (2006.01) B32B 15/08 (2006.01)

Patent

CA 1127062

ABSTRACT OF THE DISCLOSURE In a peelable bonded structure comprising a metal substrate and a polyolefin layer bonded to the substrate through a primer layer, wherein the primer layer is a com- position comprising (A) a modified olefin resin having a carbonyl group concentration of 0.01 to 200 milliequivalents per 100 g of the olefin resin and (B) a coating film-forming base resin at an (A)/(B) weight ratio of from 0.1/99.8 to 70/30. The primer layer has in at least one first planar region thereof a multi-layer distribution structure having a resin concentration gradient in the thickness direction such that the modified olefin resin (A) is distributed predominantly in the portion of the primer layer contiguous to the polyolefin layer and the base resin (B) is distri- buted predominantly in the portion of the primer layer con- tiguous to metal substrate, and in at least one second planar region the modified olefin resin (A) is distributed in the portion of the primer layer contiguous to the poly- olefin layer at a lower distribution ratio.

317016

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