Perforated substrate and method of manufacture

B - Operations – Transporting – 26 – F

Patent

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Details

B26F 1/02 (2006.01) H01M 4/66 (2006.01) H01M 4/70 (2006.01) H01M 4/74 (2006.01)

Patent

CA 2192777

A perforated substrate having half of the perforations formed from one major surface of the substrate and the other half formed from the opposite major surface, the two major surface being coplanar is described. This introduces equal and opposite stress forces into the substrate which essentially cancel each other and provide a product meeting exacting planarity requirements.

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