Permeation layer attachment chemistry and method

Details Permeation layer attachment chemistry and method Permeation layer attachment chemistry and method

B - Operations, Transporting

01

J

B01J 19/00 (2006.01) C12Q 1/68 (2006.01) G01N 27/40 (2006.01) G01N 33/543 (2006.01)

Patent

CA 2394934

Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface.

L'invention concerne des microplaquettes adressables électroniquement présentant des couches de perméation liées de façon covalente et des procédés de production de ces couches sur des microplaquettes. La liaison de covalence est dérivée de la combinaison d'utilisation d'électrodes avec des dérivés silane. Une telle chimie permet d'appliquer une polarisation électronique aux électrodes de la microplaquette, tout en empêchant le décollement de la couche de perméation de la surface d'électrode.

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