C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
117/160, 6/222,
C08K 5/14 (2006.01) B01F 17/00 (2006.01) C03C 25/26 (2006.01) C07C 409/00 (2006.01) C08J 5/08 (2006.01) C08K 9/04 (2006.01)
Patent
CA 1176773
Abstract of the Disclosure An aqueous emuision of a solid, water insoluble or limited soluble organic peroxide is provided that has improved stability, dilute bility and safety but still having an average particle size of 1.5 microns or less and a good particle size distribution. The emulsion has from about 10 weight percent of the emuision of a solid peroxide selected from the group of hydroperoxide, ?-oxy and ?-peroxy hydroperoxides, dialkyl peroxides, aldehyde and ketone peroxides, diacyl peroxides, pernxyesters, peroxy acids, peroxydicarbonates, monoperoxycarbonates and perketals. The emulsion also has a hydrocarbon solvent having a high kauri- but and number if the organic peroxide has a substantial amount of aro- maticity and a low kauri-butanol number if the organic peroxide has little or no aromaticity and one or more nonionic emulsifiers and at least about 45 weight percent of water. The method of preparing the emulsion involves solubilizing the peroxide in the hydrocarbon solvent and adding the emul- sifiers and emulsifying. The emulsion of organic peroxide can have many uses including uses in vinyl and diene polymerization, and being used in a sizing composition for glaes fibers to produce treated glass fiber strands that can be used in polymer reinforcement such as the reinforcement of polyolefins, polyemides and polyeater.
357413
Borden Ladner Gervais Llp
Ppg Industries Ohio Inc.
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