C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/1314, 400/73
C08K 3/34 (2006.01) C08G 8/04 (2006.01) C08L 61/06 (2006.01) C09J 161/06 (2006.01)
Patent
CA 1152679
ABSTRACT OF THE DISCLOSURE An adhesive and a process for making wood laminates with the adhesive. The adhesive comprises a phenol-formal- dehyde condensation product having a molar ratio of phenol to formaldehyde in the range of 1:1.5 to 1:2.5, a sodium hydroxide catalyst, and from 20-35% to 50% bentonite clay based upon the phenol-formaldehyde condensation product solids. She new adhesive is employed to prepare laminates using high moisture content veneers, such as southern pine. The laminates exhibit average percent wood failures of from 85 to 98%.
343937
Brown Timothy M.
Hartman Seymour
Champion International Corporation
Frayne & Company Robert
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