Phenol formaldehyde steam pressing of waferboard

Details Phenol formaldehyde steam pressing of waferboard Phenol formaldehyde steam pressing of waferboard

B - Operations, Transporting

27

N

B27N 3/18 (2006.01) B27N 3/12 (2006.01)

Patent

CA 2117529

The present invention relates to a method of producing a waferboard by applying first a liquid phenol formaldehyde resin (12) to the surface of the wafers (10) then a powdered phenol formaldehyde resin (14) followed by forming a layup (16) and pressing at elevated temperature and pressure using steam pressing techniques (18) to consolidate the layup into a board and set the phenol formaldehyde adhesive.

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