C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
400/102, 402/292
C08G 59/00 (2006.01)
Patent
CA 1231493
ABSTRACT OF THE DISCLOSURE This invention is directed to phenolic hydroxyl- -containing compositions and to epoxy resins prepared therefrom, the compositions having more than one phenolic hydroxyl group and more than one aromatic ring per molecule, which is substantially free of ether groups, and which composition results from an acid catalyzed reaction of (A) at least one aromatic compound contain- ing at least one aromatic hydroxyl group and from one to two aromatic rings and at least one ortho or para position relative to a hydroxyl group available for ring alkylation; with (B) at least one unsaturated hydrocarbon. The invention is characterized in that component (B) is selected from (1) monounsaturated or diunsaturated hydrocarbons having from 4 to 6 carbom atoms or mixtures thereof; (2) unsaturated hydrocarbons containing an average of from 6 to 55 carbon atoms per molecule and containing not more than 94 weight percent dicyclopentadiene, (3) oligomers and/or cooligomers of hydrocarbon dienes, which dienes have from 4 to 18 carbon atoms, and which dienes contain at least 6 percent by weight of diene other than dicyclo- pentadiene; and (4) mixtures thereof. This invention is also directed to an epoxy resin composition resulting from the dehydrohalogenation of the reaction product of an epoxy alkyl halide with the composition having more than one phenolic hydroxyl group and more than one aromatic ring per molecule as described above. The epoxy resins of this invention have improved mold shrink properties and improved aqueous solvent resistance.
431204
Smart & Biggar
The Dow Chemical Company
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