Phenolic resin adhesion promoters and adhesive compositions

C - Chemistry – Metallurgy – 09 – J

Patent

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Details

C09J 161/06 (2006.01) B32B 7/10 (2006.01) B32B 15/08 (2006.01) C08G 8/20 (2006.01) C08G 8/24 (2006.01) C09J 5/02 (2006.01) C09J 123/28 (2006.01) C09J 123/34 (2006.01) C09J 127/00 (2006.01)

Patent

CA 2052056

An adhesion promoting composition for enhancing adhesion between an elastomeric substrate and a metal surface which, when applied at least in substantial contact with the metal surface, produces an elastomer-metal adhesive bond that withstands high temperature fluid and corrosive material environments and that can be applied without extensive pretreatment of the metal surface. The adhesion promoting composition comprises a phenolic resin derived from a first phenolic component, a second phenolic component, and a formaldehyde source, wherein the first phenolic component is a monohydroxy aromatic compound, a dihydroxy aromatic compound or a combination thereof, and the second phenolic component is a trihydroxy aromatic compound. A two-part adhesive composition containing a primer component and an overcoat component is also disclosed. The primer component contains the adhesion promoting composition and a first halogenated polyolefin while the overcoat component contains a second halogenated polyolefin and a nitroso compound.

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