Phenolic resin binder composition for no-bake foundry moulds

Details Phenolic resin binder composition for no-bake foundry moulds Phenolic resin binder composition for no-bake foundry moulds

B - Operations, Transporting

22

C

400/5413

B22C 1/22 (2006.01) C08G 18/54 (2006.01)

Patent

CA 1161981

ABSTRACT OF THE DISCLOSURE A binder composition for making molded products in conjunction with an aggregate includes in admixture a resin component comprising an organic solvent solution of a non-aqueous phenolic resin, a hardener component compris- ing a liquid polyisocyanate containing at least two isocy- anate groups, the resin component and hardener component being curable by a curing agent, and an additional compon- ent comprising an oil-soluble phenolic resin dissolved in a drying oil and partially cross-linked therewith.

381724

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