Phenolic resin compositions

C - Chemistry – Metallurgy – 08 – G

Patent

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22/158, 402/31,

C08G 8/10 (2006.01) B22C 1/22 (2006.01) C04B 26/12 (2006.01) C08G 8/28 (2006.01) C08K 5/10 (2006.01) C08L 61/10 (2006.01) C08L 61/14 (2006.01)

Patent

CA 2006225

A cured phenolic resin may be prepared by reacting (1) an esterified phenolic compound containing one or more phenolic hydroxyl groups and/or one or more esterified phenolic hydroxyl groups and further containing one or more esterified methylol groups ortho and/or para to the (esterified) phenolic hydroxyl group and (2) a phenolic resole resin in the presence of a base and water and/or other polar solvent. This technique may be used in the production of phenolic-based adhesives, foundry moulding compositions, surface coatings, foams and proppants.

Résine phénolique réticulée, préparée par réaction (1) d'un composé phénolique estérifié, renfermant un ou plusieurs groupes hydroxyles phénoliques et (ou) un ou plusieurs groupes phénoliques estérifiés, ainsi qu'un ou plusieurs groupes méthylol estérifiés en ortho et (ou) en para du groupe hydroxyle phénolique (estérifié), et (2) une résine de résol phénolique, en présence d'une base et d'eau et (ou) d'un autre solvant polaire. Cette technique peut servir à préparer des adhésifs à base phénolique, des compositions de moulage pour fonderies, des revêtements de surface, des mousses et des agents de soutènement.

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