Phenolic resin molding material

C - Chemistry – Metallurgy – 08 – L

Patent

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400/7325

C08L 61/06 (2006.01) C08L 61/10 (2006.01)

Patent

CA 2006608

PHENOLIC RESIN HOLDING MATERIAL Abstract of the Disclosure A phenolic resin molding material is provided which is curable under neutral or alkaline conditions and which com- prises: (a) a resole phenolic resin; (b) a curing adjustor selected from an oxide or hydroxide of an alkaline earth metal and a silane compound; and (c) a mixture of fillers wherein the filler has an oil absorption of 15 to 50 mg/100 g measured by the linseed oil method according to JIS X-5101. suitable fillers are calcium carbonate, aluminum hydroxide and barium sulfate. These fillers may also be combined with a filler selected from clay, talc, and microbeads. The compositions may be combined with a fibrous reinforcement material and used as sheet molding compounds.

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