C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
402/50, 18/715,
C08G 8/24 (2006.01) B29C 45/00 (2006.01) C08J 5/00 (2006.01) C08K 5/13 (2006.01) C08L 61/06 (2006.01) C08L 61/08 (2006.01)
Patent
CA 1076290
ABSTRACT OF THE DISCLOSURE There is disclosed a thermosetting phenolic resin composition, suitable for use in injection molding, which resin composition contains a molding grade phenolic resin t-butylphenol) that us capable of reducing the viscosity of the molding compositionscontaining said phenlic resin composition to a processable viscosity at a temperature at which the period of time within which said molding compo- sition cures to a theremoset state is longer than the period of time that said molding composition is in the runner during a normal injection molding operation. There is also disclosed molding compositions containing said phenolic resin composition, and an injection molding process utilizing the same.
233686
Na
Union Carbide Corporation
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