C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
400/4008, 400/42
C08L 33/00 (2006.01) B32B 27/04 (2006.01) C08L 61/06 (2006.01) C09J 123/08 (2006.01) C09J 161/06 (2006.01) C09J 163/00 (2006.01) H05K 3/38 (2006.01) C08L 13/00 (2006.01) C08L 21/00 (2006.01) C08L 23/08 (2006.01) C08L 63/00 (2006.01) H05K 1/00 (2006.01)
Patent
CA 1267986
PHENOLIC RESINS, CARBOXYLIC RESINS AND THE ELASTOMERS CONTAINING ADHESIVE ABSTRACT An adhesive is disclosed for use in flexible circuitry, laminates and electrical products. The adhesive has improved flexibility and adhesive properties. It may be applied in solution form or may be cast as a free-standing film which is later heated and compressed to give adhesive properties. The adhesive comprises a phenol- aldehyde resin or other phenolic resin, an epoxy resin and an elastomer.
501720
Goudreau Gage Dubuc
Santorelli Michael
Schenectady Chemicals Inc.
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