H - Electricity – 05 – K
Patent
H - Electricity
05
K
400/5906
H05K 3/38 (2006.01) C08G 59/40 (2006.01) C08G 59/50 (2006.01) C08L 63/00 (2006.01) H01B 3/40 (2006.01)
Patent
CA 939094
Fujiwara Yoshio
Naito Keiichi
Odajima Toru
LandOfFree
Phenoxy, epoxy resin adhesive for making printed circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Phenoxy, epoxy resin adhesive for making printed circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Phenoxy, epoxy resin adhesive for making printed circuit board will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-533175