C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
C08L 69/00 (2006.01) A61C 13/225 (2006.01) C08F 290/14 (2006.01) C08L 33/10 (2006.01) C08L 91/06 (2006.01) C08L 101/00 (2006.01) C09D 191/06 (2006.01)
Patent
CA 2061002
ABSTRACT OF THE DISCLOSURE: A photo-curable resin composition containing a polycarbonate having a number average molecular weight of between 200 and 10,000 and containing at least two (meth)acrylate groups in the molecule, or a diglycidyl phthalate (meth)acrylate, an organic polymer fine powder having an average particle diameter of between 1 µm and 50 µm and a photo-radical polymerization initiator; and a coating liquid to be applied to a resin pattern. This resin composition is useful for preparing a clasp pattern exhibiting a theoretical form for retention, durability, etc., i.e., a cast clasp basic pattern, for producing, by a lost wax method, a east clasp which is a metal component for holding a partial denture, retaining it and supporting it.
Mitsui Chemicals Inc.
Smart & Biggar
LandOfFree
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