C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
356/178, 204/91.
C23C 20/08 (2006.01) B01J 19/12 (2006.01) C01B 33/12 (2006.01) C04B 41/50 (2006.01) C04B 41/87 (2006.01) H01L 21/316 (2006.01)
Patent
CA 1225362
PROCESS FOR DEPOSITING METALLIC COPPER Abstract of the Disclosure Metallic copper is deposited on a substrate by a process which involves confining the vapor of a fluorinated organic copper compound in an enclosed chamber containing the substrate, and decomposing the copper compound by means of irradiation with light.
436856
Blum Samuel E.
Brown Karen H.
Srinivasan Rangaswamy
International Business Machines Corporation
Rosen Arnold
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