C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
31/166, 117/23,
C08L 63/02 (2006.01) C08G 59/68 (2006.01) C08K 3/00 (2006.01) C08K 5/00 (2006.01) G03F 7/029 (2006.01)
Patent
CA 1277070
Photocurable epoxy resin compositions which contain fillers, and the use thereof Abstract of the Disclosure The invention relates to epoxy resin compositions which contain fillers, said compositions comprising (a) 5-90% by weight of an epoxy resin or mixture of epoxy resins, which resin or resins do not contain olefinically unsaturated C=C double bonds, (b) 0.1 to 15% by weight of at least one photoinitiator of formula I [(R1)(R2M)a]+an Image [LQm]-q (I), wherein a is 1 or 2 and each of n and q independently of the other is an integer from 1 to 3, H is the cation of a monovalent to trivalent metal of Periodic Groups IVb to VIIb, VIII or Ib, m is an integer corresponding to the valency of L + q and Q is a halogen atom, L is a divalent to heptavalent metal or non-metal R1 is a .pi.-arene and R2 is a .pi.-arena or the anion of a .pi.-arene, and (c) 10 -90% by weight of at least one finely particulate filler selected from the group consisting of carbon black, graphite, metal-containing fillers and fillers with semi-conductor properties, and, optionally (d) flux materials and/or (e) further additives, the sum of all components being 100% by weight. These compositions are suitable for the production of relief structures, images or bonds.
495135
Buhler Niklaus
Giller Gerald
Buhler Niklaus
Ciba-Geigy Investments Ltd.
Fetherstonhaugh & Co.
Giller Gerald
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