C - Chemistry – Metallurgy – 08 – F
Patent
C - Chemistry, Metallurgy
08
F
C08F 222/02 (2006.01) C08C 19/28 (2006.01) C08F 236/04 (2006.01) C08F 290/12 (2006.01) C08L 13/00 (2006.01) G03F 7/038 (2006.01) H05K 3/28 (2006.01)
Patent
CA 2050574
ABSTRACT A photocurable resin composition comprising (a) a modified resin prepared by reacting an .alpha.,.beta.-unsaturated dicarboxylic acid anhydride adduct having a softening point ranging from 70 to 200 °C and derived from a conjugated diene polymer or copolymer having a number average molecular weight of 500 to 5000 and a vinyl content of 50 mole % or above, with an .alpha.,.beta.-unsaturated monocarboxylic acid ester having an alcoholic hydroxy group represented by the following formula (I), Image (I) wherein R1 and R2 each represent hydrogen or methyl, and R3 represents a hydrocarbon residue having at least 2 carbon atoms which may contain a heteroatom therein, to cause ring opening at least 10 mole % of the acid anhydride present in the adduct, (b) a wax having a melting point of not higher than 100 °C, and (c) a photopolymerization initiator.
Inoue Satoru
Kuroki Teruhisa
Narahara Hisao
Oomika Hiroyoshi
Yamaguchi Tatsuo
Nippon Petrochemicals Company Limited
Swabey Ogilvy Renault
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