Photoetched cooling slots for diffusion bonded airfoils

Details Photoetched cooling slots for diffusion bonded airfoils Photoetched cooling slots for diffusion bonded airfoils

F - Mech Eng,Light,Heat,Weapons

01

D

F01D 5/14 (2006.01) B23P 15/02 (2006.01) B23P 15/04 (2006.01) F01D 5/18 (2006.01)

Patent

CA 2068149

13DV09881 ABSTRACT Cooling passages are accurately formed along the faying surfaces of a pair of diffusion bonded members such as a pair of half sections used to fabricate an airfoil. particularly advantageous application of the invention is the photoetching of cooling air grooves into the opposed surfaces of a diffusion bonding foil used to form a diffusion bond between the faying surfaces of a trailing edge portion of a turbine blade or turbine vane. Such grooves may be made extremely small and in high numbers to promote efficient cooling of the trailing edge portions of these airfoils.

Affiliated with

Also associated with

Rating

Photoetched cooling slots for diffusion bonded airfoils does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photoetched cooling slots for diffusion bonded airfoils, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photoetched cooling slots for diffusion bonded airfoils will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-2082654