Photoflash array quick-cure laminating process

F - Mech Eng,Light,Heat,Weapons – 21 – K

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F21K 5/00 (2006.01) G03B 15/04 (2006.01) H05K 3/20 (2006.01) H05K 1/02 (2006.01) H05K 1/09 (2006.01) H05K 3/38 (2006.01)

Patent

CA 1204919

- 9 - PHOTOFLASH ARRAY QUICK-CURE LAMINATING PROCESS ABSTRACT A quick-cure laminating process for multi-lamp photoflash arrays includes the application of a curable adhesive to a metallic printed circuit, the positioning of the adhesive-covered printed circuit adjacent a deformable rubber material and a circuit board and the printed circuit and circuit board intermediate a pair of surfaces movable with respect to one another and the moving of said surfaces to exert a compressive force on said printed circuit and circuit board while being heated to a temperature and for a time sufficient to effect attachment of the printed circuit to the circuit board. In another aspect, the circuit board may be of a deformable material, placed in contact with an adhesive-covered printed circuit, compressed and heated to effect attachment of the printed circuit to the circuit board.

410675

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