Photoimaging processes and compositions

Details Photoimaging processes and compositions Photoimaging processes and compositions

G - Physics

03

F

96/249

G03F 5/24 (2006.01) G03F 7/09 (2006.01) G03F 9/00 (2006.01) H01L 21/66 (2006.01)

Patent

CA 1294813

IMPROVED PHOTOIMAGING PROCESSES AND COMPOSITIONS ABSTRACT OF THE DISCLOSURE The step-on-wafer process, also known as the step-and-repeat alignment process, for the production of very large scale integration (VLSI) microcircuitry with multi-layer interconnects, is greatly facilitated by incorporating, into at least the first layer of photo- resist, a dyestuff which meets certain criteria the chief of which is that it be transparent to radiation to which the photoresist system is sensitive and that it absorb radiation of a wavelength to which the photo- resist system is not sensitive. The use of photoresist systems in association with such dyestuffs has addi- tional advantages. For example, the thickness of the photoresist layer deposited on a substrate can be checked prior to imaging without activating the photo- resist.

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