Photonic integrated circuit comprising a resonant optical...

Details Photonic integrated circuit comprising a resonant optical... Photonic integrated circuit comprising a resonant optical...

G - Physics

02

B

G02B 6/42 (2006.01) G02B 6/122 (2006.01) H01S 5/026 (2006.01) G02B 6/12 (2006.01)

Patent

CA 2367708

The invention concerns a photonic integrated circuit comprising a resonant optical component and methods for making said circuit. The invention is characterised in that the resonant optical component (2) is placed above a photon collector (10) formed at the end of a light guide (4) of the circuit and vertically coupled with said part. The method for making said circuit consists in: forming for example a substrate comprising a first layer designed for producing the guide and a second layer for making a coupling layer (12) between the component and the guide part and transferring on said coupling layer, by a technique called wafer bonding, a layer designed for making the component or comprising same. The invention is particularly applicable to optical telecommunications and interconnections.

Selon l'invention, le composant optique résonant (2) est placé au-dessus d'un collecteur de photons (10) formé à l'extrémité d'un guide de lumière (4) du circuit et couplé verticalement à cette partie. Pour fabriquer ce circuit on forme par exemple un substrat comprenant une première couche destinée à la fabrication du guide et une deuxième couche destinée à la fabrication d'une couche de couplage (12) entre le composant et la partie du guide et l'on rapporte sur cette couche de couplage, par une technique dite de collage de plaquette, une couche destinée à la fabrication du composant ou comprenant ce dernier. L'invention s'applique notamment aux télécommunications et interconnexions optiques.

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