Photopolymerisable compositions

Details Photopolymerisable compositions Photopolymerisable compositions

C - Chemistry, Metallurgy

08

F

402/123, 347/39,

C08F 218/00 (2006.01) B23K 35/22 (2006.01) C08F 299/06 (2006.01) C08G 18/67 (2006.01) C08G 18/83 (2006.01) C08G 75/04 (2006.01) C08J 3/28 (2006.01) G03F 7/032 (2006.01) H05K 3/28 (2006.01)

Patent

CA 1136796

Abstract of the Disclosure A photopolymerisable composition particularly useful as a solder resist composition able to withstand molten solder without loss of adhesion, pitmarks or shrinkage and for forming durable coatings on substrates generally is obtained by a combination of a photoinitiator, a polythiol acting as a chain modifier, and a polymer having hydroxy terminated chains capped by acrylate groups connected to the chains via the residue of a polyisocyanate.

336747

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