Photopolymerization type resin composition and solder resist...

Details Photopolymerization type resin composition and solder resist... Photopolymerization type resin composition and solder resist...

G - Physics

03

F

96/178, 400/4206

G03F 7/26 (2006.01) C09D 11/10 (2006.01) H05K 3/28 (2006.01)

Patent

CA 1151789

ABSTRACT OF THE DISCLOSURE: A photopolymerization type resin composition consisting of one or more resins selected from a group consisting of resol type epoxy-acrylates, novolak type epoxy-acrylates, resol type epoxy-methacrylates and novolak type epoxy-meth-acrylates; an unsaturated compound whose end groups of ethylene are less than those of said one or more resins; and a photo-sensitizer. The resin composition is useful for the solder-resist applied to a flexible base plates of printed circuit boards.

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